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Micro-Technology develops and sells three-dimensional packaging substrates and related products for integrated circuits.
Established in 2017 and based in Chengdu, China, Micro-Technology develops three-dimensional packaging substrates for integrated circuits. Its products include TGV substrates, micro- and mini-LED substrates, electronic cigarette atomizers, and process equipment for advanced packaging and other applications. The company invested CNY 80 million in a TGV substrate and 3D integrated packaging pilot line in 2022. In September 2025, it raised Series A funding from Hua Capital Management, GLP Hidden Hill Capital, Chengdu Jinkong Finance Development Fund, CDHT Hi-Tech Venture, and Grit Ventures.
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