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Microview Intelligent Packaging develops high-precision chip packaging equipment.
Founded in 2019 and based in Shenzhen, China, Microview Intelligent Packaging develops precision die bonding and chip packaging equipment for applications including military, aerospace, and healthcare. Its products include molding and flip-chip machines, with equipment exported to Europe and America. The company closed a Series B round in August 2025 to support R&D in advanced packaging, product development, and international expansion.
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