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MSTECH develops and provides fan-out wafer-level advanced packaging products and services.
Founded in 2018 in Hangzhou, China, MSTECH develops and produces fan-out advanced packaging, with branch offices in Shanghai and Gaoyou. Its products include single-chip and multi-chip fan-out packages, system-in-package products, and stacked packages for 5G, AI, automotive, IoT, medical, and wearable devices. It also provides design simulation, packaging, and testing services. In March 2025, it closed Series B funding from Leaguer Group, Zhaoken Capital Management (Beijing), and Chenlong Group to expand its packaging line and support research and market development.
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