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The National Center for Advanced Packaging develops semiconductor packaging and testing processes and services.
Established in 2012 and based in Wuxi, China, the National Center for Advanced Packaging researches wafer-level packaging and system-in-package applications. It provides packaging design and simulation, advanced packaging services, reliability testing and failure analysis. In June 2025, it raised CNY 515 million in venture funding from ICBC Capital Management.
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