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NovoLINC develops thermal interface materials for electronics, automotive systems, and industrial machinery.
NovoLINC develops thermal interface materials designed to improve heat dissipation in electronic applications. Its products target consumer electronics, automotive systems, and industrial machinery. Established in 2024, the company is based in Pennsylvania, US. In December 2025, it raised USD 10.2 million in seed funding from Fathom Fund and TDK Ventures, with participation from Hitachi Ventures, Foothill Ventures, M Ventures, Carnegie Mellon University, and others.
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