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Pepper Gray Technology provides heat sink and cooling solutions for industrial laser chips.
Founded in 2022 and based in Dongguan, China, Pepper Gray Technology makes heat sinks and heat dissipation solutions for industrial laser chips. Its products include chip heat sinks and 45W laser chip packaging bases for uses such as vehicle headlamp LEDs, IGBT, optical communications, AR&VR, and lidar. In February 2026, it raised Series B+ funding from Dongguan Financial Holdings Group and ABC Capital.
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