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QLsemi develops semiconductor packaging materials, equipment, processes, and reliability testing.
Founded in 2021, QLsemi provides high-performance chip packaging solutions, including sintered silver paste, coated copper sheet, testing equipment, process development, and device reliability evaluation. It has a production and assembly workshop in Tianjin and an office in Suzhou, and holds ISO9001, ISO14001, and IATF16949 certifications. The company is based in Beijing, China, and closed venture funding in December 2024.
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