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Samcien develops electronic packaging materials and systems for wafer processing and device manufacturing.
Founded in 2016 and based in Shenzhen, Samcien develops electronic packaging materials and related systems. Its offerings include temporary bonding and debonding systems, wafer processing materials, and solutions for thin-wafer processing, 3D packaging, flexible displays, and conductive interconnection. It raised strategic investment led by SDIC Venture Capital in May 2023 and venture funding in December 2024.
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