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Shenzhen Hongce Precision Technology develops wafer-level semiconductor inspection products, including probe cards and test boards.
Established in 2021 and based in Zhongshan, China, Shenzhen Hongce Precision Technology develops semiconductor wafer-level inspection solutions. Its products include cantilever, vertical, and MEMS probe cards, load boards, and IC aging test boards for applications such as display driver, image sensor, and logic chips. In November 2023, it closed pre-Series A funding led by HighLight Capital.
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