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Shenzhen Xinyuan develops semiconductor packaging materials for power semiconductors and integrated circuits.
Founded in 2022 and based in Shenzhen, the company produces packaging materials including sintered silver, conductive adhesives, diffusion soldering and electromagnetic shielding materials. Its products are used in areas such as electric vehicles, RF communications, smart grids, IGBT, photovoltaics and optoelectronics. It raised Series C funding from Xiaomi Private Equity Fund Management in May 2025.
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