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Sichip Micro provides semiconductor packaging and development services, including for IGBT and SiC MOS power devices.
Founded in 2015, Sichip Micro provides advanced semiconductor packaging for power devices such as IGBT and SiC MOS, as well as radio frequency and microwave applications. It offers CRO/CDO/CDMO services to industry clients. The company is based in Sichuan, China. In September 2026, it raised Series B funding from Yangtze River Industry Fund, Tsingstone Capital, Wuxi Nce Power Co., Ltd., and other investors.
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