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SiCT manufactures ceramic substrates and semiconductor packaging materials.
SiCT develops aluminum nitride and silicon nitride ceramic substrates, DCB and AMB substrates, and related materials for semiconductor packaging and power electronics. Its products are used in renewable energy systems, electric vehicles, telecommunications and industrial electronics. Founded in 2021 in Suzhou, China, the company closed a venture funding round in August 2025 and plans to expand into Europe and North America.
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