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Silicool develops and manufactures semiconductor packaging equipment for chip and electronics production.
Founded in 2018 and based in Zhuhai, Silicool develops semiconductor packaging equipment, including IGBT module mounting, pre-sintering bonding and lens lamination systems. Its equipment serves mobile phone modules, power semiconductors and AI chips. In December 2025, it received strategic investment from Anxin Capital, Huatai Zijin Investment, SDIC Unity Capital, Xinlian Capital, ZWC Ventures and other investors.
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