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SJ Semiconductor provides wafer fabrication and testing services, including wafer bumping, CP testing and WLCSP.
Founded in 2014, SJ Semiconductor is based in Jiangyin, China, and provides wafer manufacturing and testing services. Its products and processes include wafer bumping, CP test, WLCSP and the SmartPoser™ platform, used in smartphones, communications, computing and data centers. In December 2024, the company raised USD 700 million in venture funding for an ultra-high-density three-dimensional multi-chip interconnection project.
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