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Suzhou Keyang provides semiconductor packaging and testing services, including wafer-level chip scale packaging.
Founded in 2013 and based in Suzhou, China, Suzhou Keyang provides semiconductor packaging and testing services, with a focus on wafer-level chip scale packaging. Its products include CIS, fingerprint identification chips, MEMS, and WLCSP for mobile, security, and automotive uses. The company uses TSV, Bumping, and RDL technologies.
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