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Suzhou Xinhe Semiconductor Material develops ceramic bonding tools and materials for semiconductor packaging.
Established in 2021 and based in Taicang, China, Suzhou Xinhe Semiconductor Material develops semiconductor bonding tools. Its products include ceramic cleavers for gold, silver and copper wires, as well as chip packaging bonding material solutions. The company raised over CNY 100 million in Series A funding from Zheshang Venture Capital in February 2023.
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