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Suzhou Xinrui Technology develops and sells semiconductor wafer bonding and debonding equipment.
Founded in 2021, Suzhou Xinrui Technology develops, produces and sells semiconductor wafer bonding equipment in Suzhou, China. Its products include temporary and permanent bonding equipment and laser and thermal debonding equipment, used in RF and power devices, advanced packaging and optical communications. The company has served customers including SMIC, SANA, Josun Micro, Changguang Huaxin and CEC. It raised over CNY 100 million in Series B funding in December 2023 to develop hybrid bonding equipment.
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