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Systech develops and supplies wet-process electroplating and surface treatment equipment for semiconductor manufacturing.
Systech provides wet-process electroplating equipment and related development, production, sales, and service for semiconductor manufacturing. Its products include horizontal and chemical plating equipment, cleaning and de-gluing equipment, and supply systems. Based in Shanghai, China, the company was established in 2016. In April 2024, it raised over CNY 100 million in Series B funding.
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