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Techsense manufactures automation equipment for semiconductor packaging and testing.
Techsense is a semiconductor automation equipment manufacturer based in Shanghai, China, established in 2013. Its products include ball, epoxy, DAF, and chip stack mounters, as well as inspection, measurement, and laser application equipment. The equipment serves semiconductor wafer manufacturing, packaging and testing, OLED displays, factory automation, and PCB, FPC, and substrate manufacturing. Its clients include Sandisk, NXP, Amkor, and AT&S. In April 2023, it received Series C funding from IDG Capital, Shang Qi Capital, Hudson Capital, and others.
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