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Teramount develops packaging technology that connects optical components to silicon for integrated photonics.
Founded in 2013 and based in Jerusalem, Israel, Teramount develops packaging solutions for integrated photonics. Its patent-pending Photonic-Plug is designed to connect optics to silicon. In July 2025, the company raised USD 50 million in venture funding led by Koch Disruptive Technologies, with AMD Ventures, Hitachi Ventures, Samsung Strategy & Innovation Center, Wistron Corporation, Grove Ventures, and other investors participating.
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