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TF Microelectronics provides integrated circuit packaging and testing services for chips, memory and electronic modules.
TF Microelectronics provides integrated circuit packaging and testing services, with technologies including Bumping, WLCSP, FC, BGA and SiP. Its products include packaging for processors, memory, information terminals and power modules. Founded in 1994, the company is based in Nantong, China, with more than 15,000 employees and over 2,000 research and development staff.
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