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TiSC develops nano-metal oxide photoresists and other photolithography materials for semiconductor manufacturing.
Founded in 2021 and based in Wuxi, China, TiSC develops photolithography materials, including nano-metal oxide photoresists for semiconductor manufacturing. Its products include EUV, DUV, e-beam, and 3D printing photoresists. In March 2026, it raised CNY 30 million from China Xiongan Group Fund Management and Sinic-Tek to support product development and expansion into North America and Europe.
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