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Top Leading develops and manufactures test equipment for semiconductor packaging and related fields.
Founded in 2016 and based in Guangzhou, China, Top Leading develops test equipment for semiconductor packaging. Its products include turret testers, ceramic package AOI systems, pin insertion machines, and crimping machines. The company has more than 50 patents and software copyrights and has worked with HONDA, TOYOTA, and SIEMENS. In March 2024, it closed strategic funding to establish testing and equipment research, innovation, and service centers.
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