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Tuojing Jianke develops and sells semiconductor wafer bonding, grinding and testing equipment.
Tuojing Jianke (Haining) Semiconductor Equipment Co., Ltd. develops, produces and sells equipment for integrated circuit manufacturing. Its products include wafer bonding, back grinding and testing equipment, as well as laser debonding and bond overlay measurement systems. Founded in 2020, it is based in Jiaxing, China. In September 2025, the company raised CNY 1.04 billion from Guofang Fund Management, Piotech Co., Ltd., SDIC Venture Capital, Tongxin Licheng Capital, Zhan Yun He, Zhan Yun Qi and other strategic investors.
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