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Twin Solution supplies semiconductor testing interfaces and related automation equipment.
Founded in 2007, Twin Solution provides wafer, package, and burn-in test interfaces and automation equipment, including ATE test sockets, MEMS chip probes, and Mini Handlers. Its products are used in 5G communications and IoT. The company is based in Shanghai, China, with offices in Suzhou, Beijing, and Silicon Valley. In March 2025, it raised an undisclosed Series C round co-led by Govtor Capital and Anhui Zhongan Capital Management, with participation from Suzhou Zhanxin, Kunshan Guoke Venture Investment, and returning investor Addor Capital.
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