Company

TylSemi, Inc.

TylSemi develops reusable chiplets and silicon components for AI infrastructure.

About

TylSemi develops chiplet-based silicon building blocks, including products for processing, switching, connectivity and system scaling. Its solutions are designed for integration into AI infrastructure. Founded in 2026, the company is based in San Jose, US. In July 2026, it raised USD 43.00 mn led by Matter Venture Partners, with Egis Technology Inc., Global Hands-On VC and Viola Group participating.

1Funding rounds

3Investors

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