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TYSiC develops and manufactures silicon carbide epitaxial wafers and power semiconductor products.
Founded in Dongguan, China, in 2009, TYSiC researches and develops silicon carbide epitaxial wafers, including 4-inch, 6-inch, and 8-inch products. It supplies power semiconductor manufacturers, research institutions, universities, and laboratories. In December 2025, the company completed an IPO on the Hong Kong Stock Exchange under ticker 2658.
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