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UNICCT develops semiconductor heat sink materials, including ceramic carriers and prefabricated solder heat sinks.
UNICCT develops semiconductor heat sink materials, including ceramic carriers, prefabricated solder heat sinks, ceramic cover plates, and thin-film passive integration products. Its materials serve optical communications, industrial lasers, laser radar, and laser displays. Founded in 2024, the company is based in Dalian, China, with an R&D center in Suzhou and production base in Shijiazhuang. In February 2025, it raised pre-Series A funding led by Yuhua Capital, with participation from Zhenhe Venture Capital.
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