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Vinci4D develops simulation software for semiconductor chip design and engineering.
Vinci AI provides simulation tools for semiconductor packaging and thermal analysis, using a physics foundation model and GPU-native solvers. The company serves semiconductor firms globally. Founded in 2023 and based in Palo Alto, US, it raised USD 250 million in Series B funding in October 2026, co-led by Advent International, Temasek Holdings and Xora Innovation, with Eclipse Ventures, Khosla Ventures and Madrona Venture Group participating.
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