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Wanying Microelectronics provides advanced semiconductor packaging and testing services.
Founded in 2021 and based in Chengdu, China, Wanying Microelectronics provides semiconductor packaging and testing services. Its capabilities include wire bonding, flip-chip mounting, sealing, simulation, prototyping, mass production, reliability testing and failure analysis. In August 2025, it raised Series A funding from CDHT Hi-Tech Venture.
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