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Winscene develops photothermal curing materials and electronic-grade wet chemicals for electronics manufacturing.
Founded in 2019 and based in Shanghai, Winscene develops functional materials for optical communications, semiconductor packaging and displays. Its products include optical adhesives, conductive adhesives and photosensitive polyimide, used in 5G communications, chip packaging and display manufacturing. In May 2025, it raised approximately CNY 100 million in Series B+ funding led by F&G Venture, with Fusion, Sky 9 Capital and Korea Investment Partners (China) participating.
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