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Wushi develops wafer bonding and debonding equipment for semiconductor manufacturing.
Wushi develops equipment for wafer-level temporary bonding, debonding and permanent bonding, including the Heracles-series and WDB-Apollo300 systems. Founded in 2020, it is based in Suzhou, China. In September 2026, it raised CNY 100 million in Series A funding led by Summitview Capital, with participation from GL Ventures and other investors.
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