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Wuyuan Semiconductor develops hybrid bonding technology for advanced chip integration.
Wuyuan Semiconductor develops hybrid bonding processes for wafer-to-wafer and chip-to-wafer integration, including 3D integrated circuits and customized IC products. Founded in 2022, the company is based in Qingdao, China. In March 2026, it closed Series A+ funding from Shang Qi Capital.
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