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XCIC manufactures IC packaging substrates for advanced packaging applications.
Founded in 2021 and based in Zibo, China, XCIC produces IC substrates, including FC-CSP, FC-BGA and SIP products for data centers, AI and automotive electronics. The company closed venture funding from DHLT Investment in September 2025. It planned mass production of FC-CSP and FC-BGA in 2025, followed by expansion of the second phase of FC-BGA products in 2026.
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