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XCSemi develops and manufactures semiconductor optoelectronic chips and packaging modules.
XCSemi researches, manufactures, and provides technical services for semiconductor optoelectronic chips and packaging modules. Its products serve optical communications, LiDAR, biomedical applications, and equipment manufacturing. Founded in 2022, the company is based in Suzhou, China. In January 2026, it raised Series A funding from Taicang Capital.
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