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Xi'an-based silicon materials maker producing 12-inch silicon single crystal polished wafers and epitaxial wafers for chips.
Based in Xi'an, China and established in 2016, Xi'an ESWIN Material Technology is the silicon materials business of the ESWIN Group. It makes 12-inch silicon single crystal polished wafers and epitaxial wafers for integrated circuits, used in logic, flash memory, DRAM, image sensor and display driver chips. Its Xi'an factory has a design capacity of 500,000 wafers per month. In December 2021 it raised CNY 4 billion in Series C funding co-led by China Internet Investment Fund and CITIC Goldstone Fund Management. In June 2025 it completed an IPO raising CNY 4.634 billion on the Shanghai Stock Exchange.
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