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Xinhui Lianxin develops and sells semiconductor equipment, including wafer bonding systems.
Xinhui Lianxin researches, develops, and manufactures semiconductor equipment, including hybrid, fusion, wafer-to-wafer, and die-to-wafer bonding systems. Founded in 2024, the company is based in Suzhou, China. In January 2025, it announced CNY 233.62 million in venture funding from Dalian Bio-Chem Company Limited, Changxin Xinju Equity Investment (Anhui), China Fortune-Tech Capital, Stony Creek Capital, Gaoxin Capital, Orient Securities Capital, and Fengyuan Capital.
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