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Xinsheng Semi develops semiconductor molding systems for electronics manufacturing.
Founded in 2020 in Shanghai, China, Xinsheng Semi develops semiconductor molding systems for electronics manufacturing. Its products include wafer-level packaging systems and automated compression and transfer molding systems. In August 2025, it closed a Series B+ funding round from Yuanhe Puhua Suzhou Management. The company plans to use the funding to optimize its product portfolio and expand market applications.
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