Company

XLink Semi

XLink Semi develops audio amplifier chips for automotive and consumer electronics.

About

Founded in 2021 and based in Suzhou, China, XLink Semi develops automotive-grade audio chips, including 4x220W fully integrated Class D chips. Its products serve automotive smart cockpits, external amplifiers, AVAS, and consumer devices such as televisions, laptops, and smart speakers. In October 2025, it closed Series B1 funding co-led by Zhongsu Capital and AAC Technologies Holdings Inc, with SND Ventures Group participating.

5Funding rounds

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