Loading company…
XPTC develops ultra-precision wafer thinning equipment for semiconductor manufacturing.
Founded in 2021 and based in Yuyao, China, XPTC develops 12-inch semiconductor wafer equipment. Its products include wafer thinning equipment and an all-in-one thinning, lamination, and tearing machine, with online measurement, automated operation, and ESD control. In February 2026, it raised venture funding from Lanhor Capital, Piotech Co., Ltd., China Fortune-Tech Capital, and other investors.
Funding rounds, investors and people for this company come from licensed data. A free account shows the first rows of each section; an approved contribution opens every profile in full.
Sign in