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XUNLIN provides surface metallization and copper cladding technologies for ceramic and glass electronic substrates.
XUNLIN develops surface treatment processes, including copper cladding using its PVD deposition technology, for ceramic and glass electronic substrates. Its production lines are in Tianjin and Qingdao. Based in Tianjin, China, the company raised nearly CNY 200 million in Series B funding in August 2026.
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