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Yibu Semiconductor develops wafer-level fan-out packaging and chiplet integration technologies.
Founded in 2020 and based in Baoshan District, Shanghai, Yibu Semiconductor develops advanced semiconductor packaging technologies. It provides wafer-level fan-out packaging solutions and technologies for chiplet and 3D chip integration. In September 2025, it closed a venture funding round from Shanghai Gongzheng Investment Management and returning investor SIMIC Capital.
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