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Zhongshan Xincheng Semiconductor develops and manufactures substrates for integrated circuit packaging.
Zhongshan Xincheng Semiconductor develops, manufactures, and sells electronic materials and semiconductor packaging substrates. Founded in 2022, it is based in Zhongshan, China, and makes FC CSP and FC BGA substrates for applications including mobile processors and high-performance computing chips. In October 2025, it raised Series A funding from returning investor Zhongshan Investment Holding Group. The funds are intended to support mass production and capacity expansion.
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