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Zhongshan Zhongde Technology develops vapor chambers for chip cooling and thermal management.
Zhongshan Zhongde Technology develops high-strength vapor chambers and liquid cooling lids for semiconductor packaging, AI chips and data center servers. The company was founded in 2020 and is based in Zhongshan, China. In April 2026, it closed Series A+ funding led by Skyworth, with Oriza Holdings and Shuimu Wutong Ventures participating.
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