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Zhuhai Advanced Chip Carriers, founded in 2006 in Zhuhai, China, develops and makes coreless IC packaging substrates.
Based in Zhuhai, China, and founded in 2006, the company researches, designs and manufactures coreless IC packaging substrates, and it holds a High-Tech Enterprise Certificate. Its main products are SIP packaging substrates, FCBGA packaging substrates and embedded packaging substrates. In April 2025 it closed a venture funding round from new investor Shang Qi Capital. It generates revenue by developing IC packaging substrates.
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